Mission Impossible, this is what we thought at first when the objectives of this product solution were demonstrated. We were asked to design a scalable, modular chuck that can hold a thin Silicon wafer from the bottom without touching the top side of the wafer and still be able to process and chemically thin the bottom side of the wafer without dropping it and without colliding with the processing module on the larger machine. This solution was an engineering maneuvering state of the art execution. We have designed the chuck to have 12 individually actuated fingers to hold the wafer, and we had to keep track on each finger orientation in order to activate it at the proper time. To see this chuck in action, watch this clip.